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Robot soldering in electronic production

Not all soldering connctions in electronic production are able to produce with automated mass soldering methods like reflow- or micro wave soldering. Characteristically of all this connections is demand for single point soldering normaly a manually task. The consequence: clearly higher costs and a quality, which depends on workers feeling. Theses processes can be automized in a cost effective way. Some examples:

Specific solder joints
e.g. wired component on a
PCB in SMD-Technology
KD-Pin-Platine Li-SMD-LeadFrame Reel to reel production
e.g. capacitor on flexible
flat cable (FFC)
Small number of solder joints
e.g. cable onto printed circuit
board or ceramic substrate
Li-Kabel-Keramik Li-SMD-FPC Temperatur sensitive substrates
e.g. LEDs onto Flex (PEN/PET)
Li-Spule by restriction of assembly caused solder joints
e.g. a complete printed circuit board has to be soldered with the two connectors of a spool without re-melting the existing solder joints

Soldering method for Robot soldering

To meet the most different requirements ATN offers beyond that further soldering procedures:
Contacts mounted into plastic casings are frequently soldered with the automated soldering iron and solder wire feeder. The micro flame and the induction brazing are two contactless soldering procedures offered by ATN, which are suitable for warming up of solid components. Miniaturised applications are realised with the beam of a high-power diode laser.
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